With the HR 550 XL, Ersa presents a semi-automatic device for large assemblies (up to approx. 530 x 530 mm) – a real power package with 8-zone bottom-side heating composed of emitters and motorized X/Y fine adjustment and component rotation; suitable for industrial and power electronics as well as large-format PCBs.
Ersa HR 600/3P enables the automatic repair of fine pitch components such as µBGA and smallest chip components (01005) with highest precision. The newly developed axis system and 5-MPx cameras offer the most accurate desoldering and assembly technology in rework today.
HR 500 offers full Ersa hybrid rework technology for budget-oriented users. The HR 550´s little brother allows flexible repair of standard assemblies up to 380 x 300 mm and 50 x 50 mm component size.